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GENEVA STP

Product Detail Information

 Solder reflow with one-step processing by removing the need for flux. The end result is the replacement of a flux dispensing system, a large footprint belt furnace, and deflux machine in favor of the smaller, simpler, higher throughput, and lower cost of ownership

  -Process Applications : No Flux Solder Reflow, Screen Printing Bumps, Ball Placement, Caped Copper Pillar
  Small footprint about 1/10th cleanroom space required compared to tradition line.
  Low power consumption(12kW for 300mm machine)
  One configuration reflows lead free, eutectic, and high lead solders
  GENEVA has ability to remove or minimize voids during solder feflow