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 Electro-deposition of metal layers for wafer bumping, redistribution, integrated passives and MEMS.

-Process Applications : Pb Solder, Cu bumps, Cu lines, Cu Via Fill , SnAg Bump, Au Bumps


  Patented technology breakthrough
    “After 20 years of development IBM, you are the first to take vertical   wafer plating into production.”
  Designed specifically for advanced packaging, thick metal deposition
  Process superiority: better yield on difficult applications
  Flexibility
  scalable capacity
  quick wafer size change
  ease of chemistry change
  Lowest cost of ownership