Product Category menu

Category background

NIMBUS

Product Detail Information

Sputter deposition of multiple metal layers for under bump metallization, backside metallization, redistribution and integrated passives.

-Process Applications : UBM, RDL, AL CAP, Backside Metal, LED
-Designed for advanced packaging:
  Unique, patented architecture
  High throughput
  Best cost of ownership
  Simple design
  Thin wafer handling